Обзор продукта
- Номер продукта
- TS391SNL
- ПРОИЗВОДИТЕЛЬ
- Chip Quik, Inc.
- Каталог
- Solder
- ОПИСАНИЕ продукта
- THERMALLY STABLE SOLDER PASTE NO
Документы и СМИ
- Диаши
- TS391SNL
информация о продукте
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 0.53 oz (15g), 5cc
- Melting Point :
- 423 ~ 428°F (217 ~ 220°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 68°F ~ 77°F (20°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
ОПИСАНИЕ продукта
THERMALLY STABLE SOLDER PASTE NO
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