Документы и СМИ
- Диаши
- 70-0306-0810
информация о продукте
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 423 ~ 424°F (217 ~ 218°C)
- Mesh Type :
- -
- Part Status :
- Obsolete
- Process :
- Lead Free
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 32°F ~ 50°F (0°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
ОПИСАНИЕ продукта
SOLDER PASTE WATER SOLUBLE 500GM
Рекомендуемые продукты
Вы можете искать
MAX4649EKA-T
DG211CUE+
SI-B9U171560WW
530BC1024M00DG
MAX4615EUD
2691-832-SS
569DCBA001908BBGR
CXA2590-0000-000R00AB35H
MAX4521EUE+T
4551-632-S
BXRA-56C9000-J-04
SIT5356AI-FP-25N0-12.000000
1244-25-SS
SIT5156AE-FK-25N0-40.000000
1116T-2-AL
SPHCW1HDN825YHR3ED
MAX4692EGE-T
ISL43240IRZ
SI-B9T171560WW
530BC1030M00DG