Обзор продукта
- Номер продукта
- TS391LT250
- ПРОИЗВОДИТЕЛЬ
- Chip Quik, Inc.
- Каталог
- Solder
- ОПИСАНИЕ продукта
- THERMALLY STABLE SOLDER PASTE NO
Документы и СМИ
- Диаши
- TS391LT250
информация о продукте
- Composition :
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 281°F (138°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 68°F ~ 77°F (20°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
ОПИСАНИЕ продукта
THERMALLY STABLE SOLDER PASTE NO
Рекомендуемые продукты
Вы можете искать
CRCW04021K60JNED
MF0204FRE52-1M82
CPS16-LA00A10-SNCCWTWF-AI0GWVAR-W1057-S
WW-5KZW-6
FMP-50FR-52-412R
CPS16-LA00A10-SNCCWTWF-AI0MYVAR-W1046-S
RN12F9091CT5-50
CRCW12065M10JNEA
CRCW060310K0JNEBC
CPS16-LA00A10-SNCCWTWF-AI0BWVAR-W1020-S
MFR25SDRF52-59K
FMP-50FR-52-162R
WW-4KQR-9
CPS16-LA00A10-SNCCWTWF-AI0RWVAR-W1045-S
WW-3GQH-8
WW-ER1V-8
MF0204FRE52-1M87
RK73H1HTTC2372F
WW-5BT7-2
CPS16-LA00A10-SNCCWTWF-AI0GWVAR-W1058-S
