TC3-3.5G - Chip Quik, Inc. - Компания Chipera Limited

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TC3-3.5G

Обзор продукта

Номер продукта: TC3-3.5G

ПРОИЗВОДИТЕЛЬ: Chip Quik, Inc.

Каталог: Thermal - Adhesives, Epoxies, Greases, Pastes

ОПИСАНИЕ продукта: HEAT SINK THERMAL COMPOUND

Документы и СМИ

Диаши: TC3-3.5G

информация о продукте

Color :: Gray

Features :: -

Part Status :: Active

Shelf Life :: 60 Months

Size / Dimension :: 3.5 gram Syringe

Storage/Refrigeration Temperature :: 37°F ~ 77°F (3°C ~ 25°C)

Thermal Conductivity :: 8.50W/m-K

Type :: Silicone Compound

Usable Temperature Range :: -40°F ~ 302°F (-40°C ~ 150°C)

ОПИСАНИЕ продукта

HEAT SINK THERMAL COMPOUND

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